? semiconductor components industries, llc, 2013 december, 2013 ? rev. 8 1 publication order number: mbrs130t3/d MBRS130T3G, nrvbs130t3g surface mount schottky power rectifier this device employs the schottky barrier principle in a large area metal ? to ? silicon power diode. state ? of ? the ? art geometry features epitaxial construction with oxide passivation and metal overlay contact. ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. features ? small compact surface mountable package with j ? bend leads ? rectangular package for automated handling ? highly stable oxide passivated junction ? very low forward voltage drop (0.6 volts max @ 1.0 a, t j = 25 c) ? excellent ability to withstand reverse avalanche energy transients ? guardring for stress protection ? nrvb prefix for automotive and other applications requiring unique site and control change requirements; aec ? q101 qualified and ppap capable ? these are pb ? free devices mechanical characteristics ? case: epoxy, molded ? weight: 95 mg (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds ? shipped in 12 mm tape and reel, 2500 units per reel ? cathode polarity band maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 30 v average rectified forward current (t l = 115 c) i f(av) 1.0 a non ? repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 40 a operating junction temperature t j ? 65 to +125 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. thermal characteristics rating symbol value unit thermal resistance, junction ? to ? lead (t l = 25 c) r jl 12 c/w device package shipping ? ordering information smb case 403a http://onsemi.com MBRS130T3G smb (pb ? free) 2500 / tape & reel schottky barrier rectifier 1.0 ampere 30 volts marking diagram nrvbs130t3g smb (pb ? free) 2500 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. ayww b13 a = assembly location y = year ww = work week = pb ? free package (note: microdot may be in either location)
MBRS130T3G, nrvbs130t3g http://onsemi.com 2 electrical characteristics rating symbol value unit maximum instantaneous forward voltage (note 1) (i f = 1.0 a, t j = 25 c) v f 0.6 v maximum instantaneous reverse current (note 1) (rated dc voltage, t j = 25 c) (rated dc voltage, t j = 100 c) i r 1.0 10 ma 1. pulse test: pulse width = 300 s, duty cycle 2.0%. i f , instantaneous forward current (amps ) 1 0.5 0.2 0.1 0.05 0.03 0.02 1 0.1 0.2 0.3 0.4 0.5 0.6 0.7 v f , instantaneous forward voltage (volts) figure 1. typical forward voltage i r , reverse current (ma) 100 10 1 0.1 0.01 0 4 8 121620 242832 3640 v r , reverse voltage (volts) figure 2. typical reverse current t j = 125 c 25 c 20 2 0.2 0.02 30 3 0.3 0.03 50 5 0.5 0.05 0.7 0.07 0.3 0.8 0.9 1.1 t c = 100 c t c = 25 c 100 c 75 c i f(av) , average forward current (amps) 8 7 6 5 4 3 2 1 0 50 60 70 80 90 100 110 120 130 t c , case temperature ( c) square wave dc t j = 125 c p f(av) , average power dissipation (watts) 5 4 3 2 1 0 012345 i f(av) , average forward current (amps) 20 10 5 dc i pk i av = square wave rated voltage applied r jc = 12 c/w t j = 125 c c, capacitance (pf) 160 140 120 100 80 60 40 20 0 0 4 8 121620242832 v r , reverse voltage (volts) 36 40 180 200 40 30 9 10 capacitance load note: typical capacitance at 0 v = 160 pf figure 3. typical capacitance figure 4. current derating (case) figure 5. power dissipation
MBRS130T3G, nrvbs130t3g http://onsemi.com 3 package dimensions smb case 403a ? 03 issue j 2.261 0.089 2.743 0.108 2.159 0.085 mm inches scale 8:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* e b d c l1 l a a1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension b shall be measured within dimension l1. dim a min nom max min millimeters 1.95 2.30 2.47 0.077 inches a1 0.05 0.10 0.20 0.002 b 1.96 2.03 2.20 0.077 c 0.15 0.23 0.31 0.006 d 3.30 3.56 3.95 0.130 e 4.06 4.32 4.60 0.160 l 0.76 1.02 1.60 0.030 0.091 0.097 0.004 0.008 0.080 0.087 0.009 0.012 0.140 0.156 0.170 0.181 0.040 0.063 nom max 5.21 5.44 5.60 0.205 0.214 0.220 h e 0.51 ref 0.020 ref d l1 h e polarity indicator optional as needed on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 mbrs130t3/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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